Study Projects

At IHF, we explore cutting-edge high-frequency technologies through theoretical analysis, numerical simulation, and practical implementation — from antennas and passive components to electromagnetic sensing and advanced materials. We offer thesis and project opportunities for students with different interests and strengths: those who enjoy analytical and theory-driven work can focus on electromagnetic modelling, numerical methods, and simulation, while students with a stronger interest in experimental and application-oriented research can engage in design, prototyping, fabrication, and measurement. What makes our institute unique is the close integration of these aspects within one research environment, enabling students to follow the full development cycle or specialize in selected parts of it. With access to advanced simulation tools, in-house PCB manufacturing, RF measurement infrastructure, and workshop facilities for 3D component fabrication, IHF provides an excellent setting for both fundamental investigations and hands-on engineering projects.

1. Electromagnetic Scattering & Material Characterization

Scattering of electromagnetic waves describes incidence of a wave onto an obstacle and its re-radiation. The re-radiated wave carries information about the properties of that obstacle. The physics behind this phenomenon, in its most-simplified scenario, by assuming the obstacle to be a sphere, is explained by Mie theory. At IHF, material properties and physical size of the obstacle are simultaneously determined by scattering experiments at microwave frequencies. The scientific challenge lies in the accuracy of such characterization for single, very small scatterers. 

2. Probing an Antenna in its Reactive Near-Field and Over-the-Air Testing

This research area investigates the field distributions of different antenna radiating modes and develops coupling mechanisms and dedicated probe structures for effective electromagnetic field sensing in the immediate vicinity of the antenna element. It also includes the design of transmission-line and waveguide discontinuities as well as transitions required for the realization of these probing structures.

3. Millimetre-Wave Interconnect, Wireless Power Transfer, and Sensing Technology

The research focuses on millimeter-wave chip-to-chip interconnect technologies, with an emphasis on dielectric waveguides. Beyond conventional physical interconnects, it also includes wireless power transfer (WPT) systems using dielectric structures, including 3D-printed components, as well as highly efficient millimeter-wave lenses. 

4. Dielectric Resonators for Oscillator and Antenna Functionalities

The research area investigates the use of dielectric resonators as either an oscillator or an antenna, with a primary focus on spherical dielectric resonators and the associated challenges of planar coupling. A recent aspect of the study is concurrent operation of achieving both functionalities within the same physical footprint and analysing the resulting compromise between maintaining a high Q‑factor and preserving antenna performance. These dielectric resonator concepts extend toward on‑chip implementations operating at frequency of 100 GHz and beyond.

5. 3D Printable RF Absorbers

Research on 3D‑printed RF absorbers explores how additive manufacturing can be used to engineer highly customizable electromagnetic loss structures that overcome the geometric and material limitations of traditional carbon‑loaded foams. By leveraging tuneable geometries, these absorbers can be miniaturized for project‑specific needs such as unwanted coupling reduction in dense RF environments. 

6. Electromagnetic Imaging & Sensing

Electromagnetic imaging and sensing utilize the interaction of electromagnetic waves and fields with objects and materials to reconstruct images and extract meaningful information about their properties. At IHF, research focuses on the interaction at small object standoff distance, in order to obtained enhanced information about the object (e.g., material properties, shape and orientation, 3D features) in sub-wavelength resolution. Our work covers the complete workflow from theoretical analysis and simulation to implementation, and experimental validation.

7. General: Passive High-Frequency Components

This research area addresses the analysis, design, simulation, and implementation of passive high-frequency components such as antennas, antenna arrays, filters, resonators, power dividers, couplers, and waveguide structures. The focus lies on developing efficient and application-oriented components with well-defined electromagnetic properties, taking into account theoretical modelling, numerical optimization, fabrication, and experimental validation.

The following application domains are intended as an orientation to help students identify areas that match their interests and strengths. Depending on the topic, a thesis may focus on one specific field or combine several aspects across theory, simulation, design, and measurement. Students who are interested in multiple areas are very welcome — together, we can define a suitable thesis topic that aligns with their academic background and interests.

• RF and Microwave Devices: Chip-to-chip interconnects, wireless power transfer, millimetre-wave components 
• Antennas and Propagation: Reconfigurable antennas, dielectric rod antennas, UWB designs, polarization converters, near-field probing 
• Passive Components: Resonators, filters, power dividers, couplers, transitions, waveguide structures 
• Sensing, Imaging, and Localization: Microwave and millimetre-wave sensing, electromagnetic imaging, target detection, localization, non-destructive evaluation 
• Materials and Characterization: Electromagnetic scattering, dielectric property extraction, material characterization, Mie-theory-based analysis 
• RF Absorbers: 3D-printable absorbers, coupling reduction, interference mitigation, absorber-assisted measurement environments 
• Theory and Simulation: Electromagnetic modelling, numerical methods such as MoM and FEM, analytical models, full-wave simulation

Our research combines theoretical analysis, simulation, design, prototyping, and experimental validation. Students are involved in the full development cycle and benefit from access to advanced software tools, measurement infrastructure, and in-house manufacturing facilities.

• Typical Workflow: Theory → Simulation → Design → Prototyping
• Typical Simulation Tools: CST Microwave Studio, Keysight ADS, MATLAB, Python, Altair FEKO, Ansys HFSS
• Measurement Capabilities: Anechoic Chamber, Vector Network Analyser (220 GHz), Spectrum Analyser, Chip Probing Station, Profilometer, Micrometer Positioning Stages
• Manufacturing Capability: PCB etching, 3D printing, mechanical workshop, wire bonding

Topics can be adapted for Bachelor’s thesis or Research Project or Master’s) theses. For more information, contact us to discuss your interests:

• German: Max Lippoldt: max.lippoldt@ihf.uni-stuttgart.de
• English: Fatemeh Habibi: fatemeh.habibi@ihf.uni-stuttgart.de 

Join us to advance high-frequency technologies!